Title :
Proceedings 1997 International Conference on Multichip Modules
Abstract :
The following topics were dealt with. Markets and infrastructure; MCM-C; MCM-D; MCM-L; flip chip technology; packaging materials; interconnect technologies; substrate processing; known good die; modelling; and integrated passives
Keywords :
flip-chip devices; integrated circuit interconnections; integrated circuit packaging; multichip modules; MCM-C; MCM-D; MCM-L; flip chip technology; integrated passives; interconnect technologies; known good die; markets; modelling; packaging materials; substrate processing;
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3787-5
DOI :
10.1109/ICMCM.1997.581135
