DocumentCode :
3417999
Title :
Electrical characterisation of vertical vapor phase doped (VPD) RESURF MOSFETs
Author :
van Dalen, R. ; Rochefort, C.
Author_Institution :
Philips Res. Leuven, Belgium
fYear :
2004
fDate :
24-27 May 2004
Firstpage :
451
Lastpage :
454
Abstract :
Publications on the optimisation of vertical RESURF MOSFETs typically only address the drift region. The drift region resistance decreases strongly with pitch size, potentially offering extremely low specific resistances when moving to smaller pitch sizes. However, at a certain pitch, one will have decreased the drift region component such that other contributions will start to play a dominant role and need to be taken into account when optimising such devices. Recently, the first vertical RESURF MOSFETs, manufactured using a trench etch and vapor phase doping (VPD) process, were presented with pitch size down to 4 μm. Based on the electrical characterisation of these devices, we evaluate the various contributions to the overall specific resistance and their effect on the attainable figure-of-merits (FOMs) of vertical RESURF devices with DMOS layout at such small pitch.
Keywords :
etching; optimisation; power MOSFET; semiconductor device breakdown; semiconductor doping; 4 micron; DMOS layout device figure-of-merit; Miller gate charge; VPD RESURF MOSFET; drift region pitch size; drift region resistance; low specific resistance; optimisation; reverse breakdown voltage; trench etch process; vertical vapor phase doped MOSFET; Etching; Optimization methods; Power MOSFETs; Semiconductor device doping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
Type :
conf
DOI :
10.1109/ISPSD.2004.1332975
Filename :
1332975
Link To Document :
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