Title :
Chemical-mechanical planarization
fDate :
30 Sep-1 Oct 1992
Abstract :
The chemical-mechanical planarization (CMP) techniques applied to insulating layers in multilayered integrated circuits are discussed. Advantages and concerns of CMP are considered. Process developments are described
Keywords :
Conducting materials; Dielectrics and electrical insulation; Etching; Fabrication; Integrated circuit interconnections; Planarization; Semiconductivity; Semiconductor device manufacture; Silicon; Substrates;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-0740-2
DOI :
10.1109/ASMC.1992.253791
