Title :
Materials issues for solutions of Power Electronic Building Blocks (PEBB)
Author :
Lostetter, A. ; Webster, I. ; Hoagland, R. ; Barlow, Fred D. ; Elshabini-Riad, Aicha ; Nelson, Douglas
Author_Institution :
Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
This paper outlines a Power Electronic Building Block (PEBB) module design strategy which extends multichip module concepts to power electronics applications. This strategy provides two power signal layers as well as the capability to include a number of control layers, within the ceramic substrate between the two power layers. In addition, wirebonds with their associated limitations are eliminated through the use of direct metal attachment to the power devices
Keywords :
multichip modules; power electronics; PEBB module design; ceramic substrate; control layer; direct metal attachment; multichip module; power electronic building block; power electronics; signal layer; Ceramics; Dielectric substrates; Electronic packaging thermal management; Inorganic materials; Metallization; Multichip modules; Power electronics; Power system reliability; Thermal management; Voltage;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581288
