DocumentCode
3418953
Title
Materials issues for solutions of Power Electronic Building Blocks (PEBB)
Author
Lostetter, A. ; Webster, I. ; Hoagland, R. ; Barlow, Fred D. ; Elshabini-Riad, Aicha ; Nelson, Douglas
Author_Institution
Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear
1997
fDate
9-12 Mar 1997
Firstpage
177
Lastpage
178
Abstract
This paper outlines a Power Electronic Building Block (PEBB) module design strategy which extends multichip module concepts to power electronics applications. This strategy provides two power signal layers as well as the capability to include a number of control layers, within the ceramic substrate between the two power layers. In addition, wirebonds with their associated limitations are eliminated through the use of direct metal attachment to the power devices
Keywords
multichip modules; power electronics; PEBB module design; ceramic substrate; control layer; direct metal attachment; multichip module; power electronic building block; power electronics; signal layer; Ceramics; Dielectric substrates; Electronic packaging thermal management; Inorganic materials; Metallization; Multichip modules; Power electronics; Power system reliability; Thermal management; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-3818-9
Type
conf
DOI
10.1109/ISAPM.1997.581288
Filename
581288
Link To Document