Investigation of cooling performance of micro-channel structure embedded in LTCC substrate for 3D micro-system

The paper reports the design, fabrication and thermal property investigation of serpentine micro-channel structure embedded in Low Temperature Co-fired Ceramic (LTCC) substrate for thermal management of 3D micro-system. Serpentine micro-channel structure is about 2cm(length) × 2cm(width) × 2mm(thickness) in dimension and the micro-channel is about 200μm×200μm in its cross section. Infrared imaging is used to test temperature distribution of the whole LTCC substrate. Based on the test results, the cooling performance of the serpentine micro-channel is evaluated. With the present design of micro-channel, the experiment shows the maximum temperature of the substrate decreases from 85°C to 48°Cas the flow rate of deionized (DI) water through the micro-channel ranges from 0.59ml/min to 2.48ml/min. When the flow rate of DI water through micro-channel is increased with an increment of 0.5ml/min from 1.87ml/min, the decrease of maximum temperature of substrate is less than 2°C.