Title :
Brain-implantable biomimetic electronics as neural prosthetics
Author :
Berger, Theodore W. ; Granacki, John J. ; Marmarelis, Vasilis Z. ; Sheu, Bing J. ; Tanguay, Armand R., Jr.
Author_Institution :
Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
Abstract :
Described in this paper is an interdisciplinary effort that will enable the functions of specific brain damaged regions to be replaced by "neurocomputational" microchips that incorporate experimentally-based mathematical models of the nonlinear dynamic properties of biological neurons. To allow the "neurocomputational" microchips to communicate with existing brain tissue, another microcircuitry element has been developed silicon-based multi-electrode arrays that are "neuromorphic", i.e., designed to conform to the region-specific cytoarchitecture of the brain. When the "neurocomputational" and "neuromorphic" components are fully integrated, the envisioned prosthetic will receive electrical impulses from targeted subregions of the brain, process the information using the hardware model of that brain region, and communicate back to the functioning brain.
Keywords :
VLSI; biomedical electrodes; biomedical electronics; biomimetics; brain models; mixed analogue-digital integrated circuits; neurophysiology; nonlinear dynamical systems; prosthetics; Si; VLSI-based model; biological neurons; brain tissue; brain-implantable biomimetic electronics; electrical impulses; functioning brain; hardware model; mathematical models; microcircuitry element; neural prosthetics; neurocomputational microchips; neuromorphic silicon-based multi-electrode arrays; nonlinear dynamic properties; region-specific cytoarchitecture; specific brain damaged regions; targeted subregions; Biomedical engineering; Biomimetics; Brain modeling; Circuits; Electrical stimulation; Hippocampus; Materials science and technology; Neurons; Prosthetics; Silicon;
Conference_Titel :
Neural Engineering, 2003. Conference Proceedings. First International IEEE EMBS Conference on
Print_ISBN :
0-7803-7579-3
DOI :
10.1109/CNE.2003.1196768
