Vacuum sand-casting system for electric and electronic parts

The viscosity of potting materials for electronic parts increases greatly when the inorganic filler is densely packed. A vaccum sand-casting system has been developed, in which filler containing resin is potted into parts that are prefilled with silica sand. Dense packing of inorganic filler in the potting materials can thus be achieved. Using this system, parts can be miniaturized as a result of improved thermal conductivity. More efficient production is made possible by the shortened process time and automation of this system