Title :
Thermal modeling techniques for heat sinks for power electronics
Author_Institution :
Wakefield Eng., MA, USA
Abstract :
This paper gives two computer modeling techniques for quickly analyzing the performance of a heat sink having an array of heat dissipating devices on the base. A case study is presented which compares a traditional heat sink model to the two techniques. Model construction time and solution time can be dramatically reduced
Keywords :
circuit analysis computing; cooling; heat sinks; power electronics; thermal analysis; computer modeling techniques; heat dissipating devices; heat sinks; model construction time; power electronics; solution time; thermal performance; Cooling; Heat engines; Heat sinks; Heat transfer; Power electronics; Resistance heating; Space heating; Surface resistance; Temperature; Thermal resistance;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3704-2
DOI :
10.1109/APEC.1997.581486
