Title :
Flip chip soldering and adhesive bonding on organic substrates
Author :
Jung, E. ; Aschenbrenner, R. ; Ostmann, A. ; Zakel, E. ; Reichl, H.
Author_Institution :
Fraunhofer-Einrichtung FhG-IZM, Berlin, Germany
Abstract :
Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization. The feasibility of these methods is demonstrated and their properties are compared
Keywords :
adhesion; electroless deposition; flip-chip devices; gold alloys; integrated circuit metallisation; integrated circuit reliability; nickel alloys; organic compounds; soldering; NiAu; adhesive bonding; bump metallization; electrolessly deposited Ni-Au; flip chip interconnections; flip chip soldering; isotropic conductive adhesive; mechanical solder ball bumps; organic substrates; thermal cycling reliability; Assembly; Bonding; Conductive adhesives; Costs; Flip chip; Integrated circuit interconnections; Metallization; Nickel; Packaging; Soldering;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.540996
