DocumentCode :
3423083
Title :
Thermal analysis based on the environmental tests of STN display
Author :
Li, Jian-Ping ; Yang, Ping ; Zhong, Jian ; Chen, Quayle ; Jing, Cherie ; Xu, Leon ; Salo, Antti
Author_Institution :
Sch. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear :
2009
fDate :
26-29 April 2009
Firstpage :
1
Lastpage :
6
Abstract :
Environmental test is widely used to verify the adaptability and reliability of various electronic products in the last decades. The sharp change of temperature and humidity in certain situations could pose a serious reliability issue on the electronic components. This paper presents an experimental study of one kind of plastic substrate based flexible display called STN (super-twisted nematic). The study focuses on the reliability of display under various temperature and humidity conditions. Considering the range of temperature and humidity changed in applications, the experiments are divided into four subgroups: cold test, cyclic damp heat test, the steady state damp heat test and dry heat test. Through all the tests, the STN display reliability was evaluated and the failure modes were obtained. Based on these tests, the thermal-structural simulation model was built. By the simulation, part of the experiment phenomenon were explained. It provides a solid foundation for further reliability study of the STN display in the practical applications.
Keywords :
environmental testing; liquid crystal displays; nematic liquid crystals; reliability; thermal analysis; STN display; adaptability; cold test; cyclic damp heat test; dry heat test; environmental test; failure modes; flexible display; reliability; steady state damp heat test; super-twisted nematic; thermal analysis; thermal-structural simulation model; Electronic equipment testing; Glass; Humidity; Liquid crystal displays; Material storage; Plastics; Steady-state; Substrates; Temperature distribution; Thin film transistors; Environmental Test; FEA; Reliability; STN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
Type :
conf
DOI :
10.1109/ESIME.2009.4938420
Filename :
4938420
Link To Document :
بازگشت