DocumentCode :
3423418
Title :
Moisture induced effects in PoP
Author :
Guédon-Gracia, A. ; Feng, W. ; Delétage, J.Y. ; Verdier, F. ; Frémont, H.
Author_Institution :
Lab. IMS, Univ. Bordeaux I, Talence
fYear :
2009
fDate :
26-29 April 2009
Firstpage :
1
Lastpage :
6
Abstract :
This paper presents a combined numerical and experimental methodology for predicting moisture-induced effects in Package-on-Package (PoP) assemblies. The hygroscopic warpage of the assembly "PoP" is measured. Its behavior is compared with the individual components "top" and "bottom". The assembly "PoP" absorbs more moisture than the sum of the two individual components, while deforms less than either of the two individual components, which holds much more constrain inside the assembly. In addition, the hygroscopic warpage (20 mum) adds to the thermal warpage (30 mum) for the assembly "PoP", which might lead to more serious reliability problem. Furthermore, a new experimental methodology for prediction of the moisture-induced warpage is validated, and simulation models match the experimental results.
Keywords :
assembling; electronics packaging; numerical analysis; hygroscopic warpage; moisture- induced effects; package-on-package assemblies; thermal warpage; Assembly; Digital cameras; Lead; Moisture; Packaging; Predictive models; Routing; Signal design; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
Type :
conf
DOI :
10.1109/ESIME.2009.4938436
Filename :
4938436
Link To Document :
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