Design, fabrication, and characterization of electrical and fluidic interconnections for a multi-chip microelectrofluidic bench

We present the design, fabrication, and characterization of a multichip microelectrofluidic bench, achieving both electrical and fluidic interconnections with a simple, low-loss and low-temperature electrofluidic interconnection method. We design 4-chip microelectrofluidic bench, having three electrical pads and two fluidic I/O ports. Each device chip, having three electrical interconnections and a pair of two fluidic I/O interconnections, can be assembled to the microelectofluidic bench with electrical and fluidic interconnections. In the electrical and fluidic characterization, we measure the electrical resistance of 0.26 Ω/mm in the line and 0.64 ± 0.58 Ω in the interconnection. Also, we measure the average pressure drop of 13.6∼125.4 Pa/mm with the nonlinearity of 3.1% for the flow-rates of 10∼100 μℓ/min in the line and 17 Pa with the uncertainty of 65 Pa in the interconnection.