DocumentCode :
3424939
Title :
Co-design and multi-physics analysis for power electronic modules
Author :
Bailey, C. ; Lu, H. ; Tilford, T. ; Rizvi, J. ; Yin, C.
Author_Institution :
Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London
fYear :
2009
fDate :
26-29 April 2009
Firstpage :
1
Lastpage :
4
Abstract :
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for power electronics models.
Keywords :
design of experiments; failure analysis; hardware-software codesign; power electronics; thermal management (packaging); design of experiments; failure analysis; hardware-software codesign; multi-physics analysis; power electronic module; thermal management; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Fatigue; Multichip modules; Power electronics; Semiconductor device packaging; Soldering; Thermal management; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
Type :
conf
DOI :
10.1109/ESIME.2009.4938505
Filename :
4938505
Link To Document :
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