DocumentCode
3427877
Title
The use of thermal images of palm-dorsa vein-patterns for biometric verification
Author
Fan, Kuo-Chin ; Lin, Chih-Lung
Author_Institution
Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-li, Taiwan
Volume
4
fYear
2004
fDate
23-26 Aug. 2004
Firstpage
450
Abstract
A novel personal verification method using the thermal images of palm-dorsa vein-patterns is presented in this paper. The characteristics of the proposed method are that no prior knowledge about the object is necessary and the parameters can be set automatically. In our work, an infrared (IR) camera is adopted as the input device to capture the thermal images of palm-dorsa. According to the heat conduction law (the Fourier law) multiple features can be extracted from each feature points of the vein-patterns (FPVPs). Multiresolution representations of images with FPVPs are obtained using multiple multiresolution filters (MRFs) that extract the dominant points by filtering miscellaneous features for each FPVP. A hierarchical integrating function is then applied to integrate multiple features and multiresolution representations. We also introduce a logical and reasonable method to select a trained threshold for verification. The experimental results demonstrate that our proposed approach is valid and effective for vein-pattern verification.
Keywords
biometrics (access control); feature extraction; heat conduction; infrared imaging; Fourier law; biometric verification; feature extraction; heat conduction law; hierarchical integrating function; infrared camera; multiple multiresolution filter; multiresolution representation; palm-dorsa vein-pattern; personal verification method; thermal image; Biomedical optical imaging; Biometrics; Cameras; Feature extraction; Fingerprint recognition; Humans; Image resolution; Infrared imaging; Robustness; Skin;
fLanguage
English
Publisher
ieee
Conference_Titel
Pattern Recognition, 2004. ICPR 2004. Proceedings of the 17th International Conference on
ISSN
1051-4651
Print_ISBN
0-7695-2128-2
Type
conf
DOI
10.1109/ICPR.2004.1333799
Filename
1333799
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