DocumentCode
343166
Title
Microelectronic packaging trends: Materials and Processes
Author
Chen, W.T. ; Lahiri, S.K.
fYear
1998
fDate
1998
Firstpage
540
Lastpage
540
Keywords
Assembly; Consumer electronics; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Manufacturing industries; Manufacturing processes; Microelectronics; Semiconductor device packaging; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785941
Filename
785941
Link To Document