DocumentCode :
3435247
Title :
Measurement and modeling of duty-cycle effects due to NBTI
Author :
Kambour, K.E. ; Nguyen, Duc Dung ; Kouhestani, C. ; Devine, R.A.B.
Author_Institution :
Air Force Res. Lab., SAIC, Kirtland AFB, NM, USA
fYear :
2012
fDate :
14-18 Oct. 2012
Firstpage :
136
Lastpage :
139
Abstract :
One of the most important requirements for modeling of the long-term effects of negative bias temperature instability (NBTI) on device/circuit response is an understanding of how to include the effect of duty cycle on the threshold voltage shift. Since NBTI is known to be comprised of both permanent and recoverable components, a measurement protocol must be established enabling separation of these components and then their recombination to predict the shift for different duty cycles. In the work reported here, we have endeavored to address these issues by combining pulsed and pseudo-DC stressing/relaxation methods.
Keywords :
MOSFET; semiconductor device measurement; semiconductor device reliability; stability; NBTI; device-circuit response; duty-cycle effect measurement; measurement protocol; negative bias temperature instability; permanent components; pseudo-DC stressing-relaxation method; pulsed-DC stressing-relaxation method; recoverable components; threshold voltage shift; Logic gates; Pulse measurements; Semiconductor device measurement; Stress; Stress measurement; Threshold voltage; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4673-2749-7
Type :
conf
DOI :
10.1109/IIRW.2012.6468939
Filename :
6468939
Link To Document :
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