Title :
Diffusion along triple junctions is this the pathway for narrow Cu conductor lines?
Author :
Lloyd, J.R. ; Adamshick, S. ; Durcan, C. ; Kandel, Y. ; Lund, I.N. ; McGowan, B.T. ; Settens, C.M. ; Zhang, Zhenhao
Author_Institution :
Coll. of Nanoscale Sci. & Eng., SUNY Albany, Albany, NY, USA
Abstract :
The possibility that the major mass transport pathway in very thin small dimension metallic nanoconductors is explored theoretically. It is seen that if we consider the triple junctions of the grain boundary intersecting with the cap and/or the liner the observations can be accounted for and that the grain boundary is never an important pathway.
Keywords :
copper; diffusion; grain boundaries; semiconductor junctions; Cu; diffusion; grain boundary intersection; mass transport pathway; narrow conductor lines; small dimension metallic nanoconductors; triple junctions; Conductors; Electromigration; Energy measurement; Grain boundaries; Junctions; Temperature; Temperature measurement;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4673-2749-7
DOI :
10.1109/IIRW.2012.6468943
