Title :
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium
Abstract :
The following topics were discussed: MCM; flip chip and TAB; substrates; soldering processes; manufacturing; sensors; thin films and thick films; packaging technology; materials; optics; components; process technology; design and analysis
Keywords :
multichip modules; MCM; TAB; components; design; electronic manufacturing technology; flip chip; materials; optics; packaging technology; process technology; sensors; soldering processes; substrates; thick films; thin films;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya, Japan
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541089
