DocumentCode
3436633
Title
Inorganic bonded mica paper for commutator and high-temperature applications
Author
Doyle, Arthur F. ; Sklarski, Dennis J.
Author_Institution
Essex Group Inc., Newmarket, NH, USA
fYear
1993
fDate
4-7 Oct 1993
Firstpage
317
Lastpage
321
Abstract
An inorganic bonded mica paper plate has been developed. It offers superior performance as commutator segment insulation. The recent history of commutator insulation in traction motors and the development of inorganic bonded mica paper (reconstituted mica) plate to meet the stringent requirements of tungsten-inert gas (TIG) welding and thermal stability under high pressure are reported. Other potential uses for this electrical insulating material in different applications, and as an alternative for asbestos-based products, are discussed
Keywords
machine insulation; TIG welding; commutator; development; electric machine insulation; electrical insulating material; high-temperature applications; history; inorganic bonded mica paper; performance; thermal stability; Bonding; Chemicals; Commutation; Composite materials; Dielectrics and electrical insulation; Insulation life; Resins; Temperature; Thermal stability; Traction motors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
Conference_Location
Chicago, IL
ISSN
1071-6270
Print_ISBN
0-7803-0847-6
Type
conf
DOI
10.1109/EEIC.1993.631086
Filename
631086
Link To Document