Common-mode noise reduction using floating conductor in LSI package

Author

Matsushima, Takaaki ; Mabuchi, Yusaku ; Hisakado, Takashi ; Wada, O.

Author_Institution

Grad. Sch. of Eng., Kyoto Univ., Kyoto, Japan

fYear

2012

fDate

9-11 Dec. 2012

Firstpage

105

Lastpage

108

Abstract

The authors proposed a method to reduce the common-mode current flowing on a wire harness attached to a printed circuit board (PCB). In this method, SMD inductors are placed on a power supply line and/or a ground line on a PCB to control balance of impedance of the power distribution network, and the common-mode current can be reduced. In this paper, the authors apply this reduction method to an LSI package, and propose a new structure of the LSI package with floating conductor which is called cover metal. The common-mode voltage is reduced about 20 dB with the package proposed in this paper.

Keywords

conductors (electric); electric impedance; inductors; integrated circuit noise; integrated circuit packaging; large scale integration; power supplies to apparatus; power supply circuits; printed circuits; surface mount technology; LSI package; PCB; SMD inductors; common-mode current; common-mode noise reduction; cover metal; floating conductor; ground line; impedance control balance; power distribution network; power supply line; printed circuit board; wire harness; Automobiles; Inductors; Metals;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE

Conference_Location

Taipei

Print_ISBN

978-1-4673-1444-2

Electronic_ISBN

978-1-4673-1445-9

Type

conf

DOI

10.1109/EDAPS.2012.6469405

Filename

6469405