Title :
Reliability and electric properties for PECVD a-SiNx:H films with an optical band-gap ranging from 2.5 to 5.38 eV
Author :
van Delden, M.H.W.M. ; van der Wel, P.J.
Author_Institution :
Philips Res. Labs. & Philips Semicond., Nijmegen, Netherlands
fDate :
30 March-4 April 2003
Abstract :
The reliability and electrical properties for PECVD a-SiNx:H films with an optical band-gap ranging from 2.5 to 5.38 eV have been investigated. The observed changes in the electrical characteristics are reviewed in terms of changes in the chemical and physical behaviour of the metastable Si dangling bonds. We found evidence that the degradation mechanism for our films is similar to that of a-SiNx:H with a band-gap < 2.4 eV. In addition, we propose that, on prolonged stress, the bonds needed in the process of metastability can become exhausted for Si-rich and N-rich materials. For intermediate materials (x∼1.2), exhaustion is also expected but not observed within the time scale of our experiments. Finally, it has been shown that TDDB can be used to describe the reliability for PECVD a-SiNx:H films whereas QBD fails to do so. The a-SiNx:H films with x > 1.2 were all shown to fulfil both the lifetime and leakage current requirements for application in passive RF networks.
Keywords :
MIM devices; amorphous state; current density; dangling bonds; dielectric thin films; electric breakdown; hydrogen; leakage currents; plasma CVD coatings; semiconductor device reliability; silicon compounds; thin film capacitors; 2.5 to 5.38 eV; Al-SiNx-Al; MIM capacitors; N-rich materials; PECVD a-SiNx:H films; Si-rich materials; TDDB; current density; degradation mechanism; electrical properties; leakage current requirements; lifetime requirements; metastable Si dangling bonds; optical band-gap; passive RF networks; reliability; Chemicals; Degradation; Design for quality; Electric variables; Leakage current; Metastasis; Optical films; Photonic band gap; Radio frequency; Stress;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197760