DocumentCode
3441007
Title
Thin film transistor circuits integrated onto elastomeric substrates for elastically stretchable electronics
Author
Lacour, Stéphanie P. ; Wagner, Sigurd
Author_Institution
Dept. of Electr. Eng., Princeton Univ., NJ
fYear
2005
fDate
5-5 Dec. 2005
Firstpage
101
Lastpage
104
Abstract
We fabricated integrated inverter circuits directly on an elastic silicone membrane substrate. Using an all-dry process, amorphous silicon thin film transistors were prepared on platforms of stiff silicon nitride, and were interconnected to inverters with elastically stretchable gold metallization. With the elastomeric substrate, rigid device islands, thin film transistors, and elastic metal interconnects, all components for an elastically stretchable active-matrix backplane have been demonstrated and integrated
Keywords
amorphous semiconductors; elastomers; gold; integrated circuit interconnections; integrated circuit metallisation; silicon compounds; substrates; thin film circuits; thin film transistors; transistor circuits; Au; SiN; active-matrix backplane; amorphous silicon; elastic metal interconnects; elastic silicone membrane substrate; elastically stretchable electronics; elastomeric substrates; gold metallization; inverter circuits; thin film transistor circuits; Active matrix technology; Amorphous silicon; Backplanes; Biomembranes; Gold; Integrated circuit interconnections; Inverters; Metallization; Substrates; Thin film transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location
Washington, DC
Print_ISBN
0-7803-9268-X
Type
conf
DOI
10.1109/IEDM.2005.1609278
Filename
1609278
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