• DocumentCode
    3441007
  • Title

    Thin film transistor circuits integrated onto elastomeric substrates for elastically stretchable electronics

  • Author

    Lacour, Stéphanie P. ; Wagner, Sigurd

  • Author_Institution
    Dept. of Electr. Eng., Princeton Univ., NJ
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Firstpage
    101
  • Lastpage
    104
  • Abstract
    We fabricated integrated inverter circuits directly on an elastic silicone membrane substrate. Using an all-dry process, amorphous silicon thin film transistors were prepared on platforms of stiff silicon nitride, and were interconnected to inverters with elastically stretchable gold metallization. With the elastomeric substrate, rigid device islands, thin film transistors, and elastic metal interconnects, all components for an elastically stretchable active-matrix backplane have been demonstrated and integrated
  • Keywords
    amorphous semiconductors; elastomers; gold; integrated circuit interconnections; integrated circuit metallisation; silicon compounds; substrates; thin film circuits; thin film transistors; transistor circuits; Au; SiN; active-matrix backplane; amorphous silicon; elastic metal interconnects; elastic silicone membrane substrate; elastically stretchable electronics; elastomeric substrates; gold metallization; inverter circuits; thin film transistor circuits; Active matrix technology; Amorphous silicon; Backplanes; Biomembranes; Gold; Integrated circuit interconnections; Inverters; Metallization; Substrates; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609278
  • Filename
    1609278