• DocumentCode
    3441204
  • Title

    GaN power switching devices

  • Author

    Ishida, Masahiro ; Uemoto, Yasuhiro ; Ueda, Tetsuzo ; Tanaka, Tsuyoshi ; Ueda, Daisuke

  • Author_Institution
    Semicond. Device Res. Center, Panasonic Corp., Nagaokakyo, Japan
  • fYear
    2010
  • fDate
    21-24 June 2010
  • Firstpage
    1014
  • Lastpage
    1017
  • Abstract
    State-of-the-art device technologies of GaN power switching transistors are reviewed. The presented technologies solve the technical issues on GaN transistors for practical use replacing currently used Si-based power devices. Thick epitaxial growth over 6-inch Si substrates enables low cost fabrication of GaN devices with high breakdown voltages. A new operating principle for the normally-off GaN transistor called Gate Injection Transistor (GIT) is proposed in which hole injection from the p-type AlGaN gate increases the drain current by conductivity modulation. Six GITs are integrated onto a single chip on silicon as the world first GaN-based monolithic inverter IC. The inverter IC successfully drives a motor with low operating loss which is 42% reduced from that of the conventional IGBT (Insulated Gate Bipolar Transistor)-based one. These technologies are indispensable for wide-spread use of GaN power switching transistors in the future.
  • Keywords
    aluminium compounds; elemental semiconductors; gallium compounds; insulated gate bipolar transistors; invertors; monolithic integrated circuits; power transistors; silicon; AlGaN; IGBT; Si; gate injection transistor; high breakdown voltages; insulated gate bipolar transistor; monolithic inverter IC; power switching devices; power switching transistors; Aluminum gallium nitride; Bipolar integrated circuits; Costs; Epitaxial growth; Fabrication; Gallium nitride; Insulated gate bipolar transistors; Inverters; Monolithic integrated circuits; Substrates; GaN; Gate Injection Transistor; Inverter IC; power switching transistor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (IPEC), 2010 International
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4244-5394-8
  • Type

    conf

  • DOI
    10.1109/IPEC.2010.5542030
  • Filename
    5542030