DocumentCode
3441204
Title
GaN power switching devices
Author
Ishida, Masahiro ; Uemoto, Yasuhiro ; Ueda, Tetsuzo ; Tanaka, Tsuyoshi ; Ueda, Daisuke
Author_Institution
Semicond. Device Res. Center, Panasonic Corp., Nagaokakyo, Japan
fYear
2010
fDate
21-24 June 2010
Firstpage
1014
Lastpage
1017
Abstract
State-of-the-art device technologies of GaN power switching transistors are reviewed. The presented technologies solve the technical issues on GaN transistors for practical use replacing currently used Si-based power devices. Thick epitaxial growth over 6-inch Si substrates enables low cost fabrication of GaN devices with high breakdown voltages. A new operating principle for the normally-off GaN transistor called Gate Injection Transistor (GIT) is proposed in which hole injection from the p-type AlGaN gate increases the drain current by conductivity modulation. Six GITs are integrated onto a single chip on silicon as the world first GaN-based monolithic inverter IC. The inverter IC successfully drives a motor with low operating loss which is 42% reduced from that of the conventional IGBT (Insulated Gate Bipolar Transistor)-based one. These technologies are indispensable for wide-spread use of GaN power switching transistors in the future.
Keywords
aluminium compounds; elemental semiconductors; gallium compounds; insulated gate bipolar transistors; invertors; monolithic integrated circuits; power transistors; silicon; AlGaN; IGBT; Si; gate injection transistor; high breakdown voltages; insulated gate bipolar transistor; monolithic inverter IC; power switching devices; power switching transistors; Aluminum gallium nitride; Bipolar integrated circuits; Costs; Epitaxial growth; Fabrication; Gallium nitride; Insulated gate bipolar transistors; Inverters; Monolithic integrated circuits; Substrates; GaN; Gate Injection Transistor; Inverter IC; power switching transistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Conference (IPEC), 2010 International
Conference_Location
Sapporo
Print_ISBN
978-1-4244-5394-8
Type
conf
DOI
10.1109/IPEC.2010.5542030
Filename
5542030
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