DocumentCode :
3441790
Title :
Electro-thermal transport in metallic single-wall carbon nanotubes for interconnect applications
Author :
Pop, Eric ; Mann, David ; Reifenberg, John ; Goodson, Kenneth ; Dai, Hongjie
Author_Institution :
Lab. for Adv. Mater., Stanford Univ., CA
fYear :
2005
fDate :
5-5 Dec. 2005
Lastpage :
256
Abstract :
This work represents the first electro-thermal study of metallic single-wall carbon nanotubes (SWNTs) for interconnect applications. Experimental data and careful modeling reveal that self-heating is of significance in short (1 < L < 10 mum) nanotubes under high-bias. The low-bias resistance of micron scale SWNTs is also found to be affected by optical phonon absorption (a scattering mechanism previously neglected) above 250 K. We also explore length-dependent electrical breakdown of SWNTs in ambient air. Significant self-heating in SWNT interconnects can be avoided if power densities per unit length are limited to less than 5 muW/mum
Keywords :
S-parameters; carbon nanotubes; electric breakdown; integrated circuit interconnections; 250 K; electrical breakdown; electro thermal transport; interconnect applications; low bias resistance; optical phonon absorption; power densities; scattering mechanism; self heating; single wall carbon nanotubes; Absorption; Acoustic scattering; Carbon nanotubes; Electric resistance; Integrated circuit interconnections; Optical scattering; Phonons; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
Type :
conf
DOI :
10.1109/IEDM.2005.1609321
Filename :
1609321
Link To Document :
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