Surface mount microwave package characterization technique

Author

Pham, A. ; Chun, C. ; Laskar, J. ; Hutchison, B.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

1997

fDate

8-13 June 1997

Firstpage

995

Abstract

We present a plastic package characterization technique using coplanar waveguide to package adapters (CPA) and line-reflect-match (LRM) calibrations. LRM calibrations on off-set CPA standards are employed to de-embed the response of CPA adapters in measured S-parameters. A variety of small shrink outline packages (SSOP) has been characterized to 26.5 GHz using this technique.

Keywords

MMIC; S-parameters; calibration; coplanar waveguides; integrated circuit packaging; measurement standards; microwave measurement; plastic packaging; surface mount technology; 0.5 to 26.5 GHz; Al/sub 2/O/sub 3/; MMIC housing; SSOP; alumina substrate; coplanar waveguide to package adapters; line-reflect-match calibrations; measured S-parameters; plastic package characterization; small shrink outline packages; surface mount microwave package characterization technique; Calibration; Coplanar waveguides; Measurement standards; Microwave technology; Microwave theory and techniques; Pins; Plastic packaging; Scattering parameters; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1997., IEEE MTT-S International

Conference_Location

Denver, CO, USA

ISSN

0149-645X

Print_ISBN

0-7803-3814-6

Type

conf

DOI

10.1109/MWSYM.1997.602969

Filename

602969