Title :
Design of test modules for the analysis of MCM interconnects
Author :
Truzzi, Claudio ; Beyne, Eric ; Ringoot, Edwin
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
Summary form only given. A thin-film Multichip Module (MCM-D) switching unit, specifically designed for performance analysis of interconnection substrates, is described. A test approach is presented for the characterisation of a given device technology as a function of geometrical, physical and electrical quantities-in this particular case, a MCM-D technology and a 0.7 μm CMOS technology
Keywords :
integrated circuit interconnections; integrated circuit testing; multichip modules; switching circuits; test equipment; thin film circuits; 0.7 micron; CMOS technology; MCM interconnects analysis; MCM-D switching unit; interconnection substrates; multichip module; performance analysis; test module design; thin-film MCM; CMOS technology; Crosstalk; Frequency; Integrated circuit interconnections; Packaging; Performance analysis; Substrates; System performance; Testing; Transistors;
Conference_Titel :
European Design and Test Conference, 1996. ED&TC 96. Proceedings
Conference_Location :
Paris
Print_ISBN :
0-8186-7424-5
DOI :
10.1109/EDTC.1996.494378
