Title :
AlGaN/GaN devices for future power switching systems
Author :
Ueda, Daisuke ; Murata, Tomohiro ; Hikita, Masahiro ; Nakazawa, Satoshi ; Kuroda, Masayuki ; Ishida, Hidetoshi ; Yanagihara, Manabu ; Inoue, Kaoru ; Ueda, Tetsuzo ; Uemoto, Yasuhiro ; Tanaka, Tsuyoshi ; Egawa, Takashi
Author_Institution :
Semicond. Device Res. Center, Matsushita Electr. Ind. Co., Ltd., Osaka
Abstract :
GaN/AlGaN device technologies are presented aiming at the applications to power switching systems. In order to reduce on-resistance (Ron), we developed SL (super lattice) capping and QA (quaternary alloy) over-layer techniques for GaN/AlGaN HFET. Further, we achieved almost the same mobility keeping the same 2DEG density for GaN/AlGaN hetero structure grown on Si (111) substrates, which will make the cost comparable to conventional Si one. The experimentally obtained RonA of the FET is 1.9 mOmegacm2, which is 14 times lower than that of Si ones. Additionally, a novel approach to realize enhancement-mode operation of GaN/AlGaN FET is examined over R-plane sapphire, where non-polar AlGaN/GaN heterostructure, free from polarization charge, can be grown
Keywords :
III-V semiconductors; aluminium compounds; carrier mobility; gallium compounds; power HEMT; power semiconductor switches; silicon; wide band gap semiconductors; AlGaN-GaN; HFET; Si; Si (111) substrates; hetero structure; on resistance; polarization charge; power switching systems; quaternary alloy over-layer techniques; sapphire; super lattice capping; Aluminum gallium nitride; Contact resistance; FETs; Gallium arsenide; Gallium nitride; HEMTs; Lattices; MODFETs; Power electronics; Switching systems;
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
DOI :
10.1109/IEDM.2005.1609355