DocumentCode :
3443396
Title :
High power SiC modules for HEVs and PHEVs
Author :
Chinthavali, M. ; Tolbert, L.M. ; Zhang, H. ; Han, J.H. ; Barlow, F. ; Ozpineci, B.
Author_Institution :
Power Electron. & Electr. Machinery Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
fYear :
2010
fDate :
21-24 June 2010
Firstpage :
1842
Lastpage :
1848
Abstract :
With efforts to reduce the cost, size, and thermal management systems for the power electronics drivetrain in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs), wide band gap semiconductors including silicon carbide (SiC) have been identified as possibly being a partial solution. Research on SiC power electronics has shown their higher efficiency compared to Si power electronics due to significantly lower conduction and switching losses. This paper focuses on the development of a high power module based on SiC JFETs and Schottky diodes. Characterization of a single device, a module developed using the same device, and finally an inverter built using the modules is presented. When tested at moderate load levels compared to the inverter rating, an efficiency of 98.2% was achieved by the initial prototype.
Keywords :
Schottky diodes; hybrid electric vehicles; invertors; junction gate field effect transistors; power electronics; silicon compounds; thermal management (packaging); wide band gap semiconductors; JFET; Schottky diodes; SiC; inverter rating; load level; plug-in hybrid electric vehicles; power electronics; switching losses; thermal management systems; Costs; Energy management; Hybrid electric vehicles; Inverters; Power electronics; Power system management; Silicon carbide; Thermal management; Thermal management of electronics; Wide band gap semiconductors; HEV; JFET; PHEV; Silicon Carbide; efficiency; hybrid electric vehicle; inverter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Conference (IPEC), 2010 International
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-5394-8
Type :
conf
DOI :
10.1109/IPEC.2010.5542158
Filename :
5542158
Link To Document :
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