A fuzzy logic method on IC lead-frame surface inspection

Author

Li, Jimin ; Oh, Weon-Geun ; Park, Chang-Joon ; Kim, Hyeon-Jin

Author_Institution

Dept. of Image Process., Electron. & Telecommun. Res. Inst., Taejon, South Korea

Volume

2

fYear

1999

fDate

22-25 Aug. 1999

Firstpage

1108

Abstract

The inspection of lead-frame is important in semiconductor industry. During the production process, the quality control of lead-frame plays an important role. Here we introduce a method for inspection of contamination and plating quality of lead frame. The basic method of segmentation of interested lead surface into five classes is discussed based on the samples supplied from IC manufacturing company. A two-stage inspection method is introduced based on the basic five classes. The discussion of the system realization and experimental results show the idea.

Keywords

automatic optical inspection; fuzzy logic; image segmentation; integrated circuit manufacture; lead bonding; quality control; IC lead-frame surface inspection; QC; contamination inspection; fuzzy logic method; image segmentation; plating quality inspection; quality control; semiconductor industry; two-stage inspection method; Computer science; Fuzzy logic; Image processing; Inspection; Laboratories; Lead compounds; Pattern recognition; Photonic integrated circuits; Production; Shape;

fLanguage

English

Publisher

ieee

Conference_Titel

Fuzzy Systems Conference Proceedings, 1999. FUZZ-IEEE '99. 1999 IEEE International

Conference_Location

Seoul, South Korea

ISSN

1098-7584

Print_ISBN

0-7803-5406-0

Type

conf

DOI

10.1109/FUZZY.1999.793109

Filename

793109