DocumentCode :
3446605
Title :
Does building-in reliability imply more or less wafer-level reliability testing?
Author :
McPherson, J.W.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1996
fDate :
20-23 Oct 1996
Firstpage :
1
Lastpage :
15
Abstract :
Wafer-level reliability (WLR) testing continues to be an important tool for implementing a building-in reliability (BIR) strategy. The thrust of WLR testing has shifted, however, from the back-of-the-line (monitoring of outgoing reliability levels) to the front-of-the-line (margin testing during the development and productization phase). The rapid nature of most WLR tests permits the process engineer to evaluate the impact of process variation and obtain an “almost instantaneous” feedback as to its reliability impact. Rapid reliability information feedback is a key to helping the process engineer to build reliability into the technology. This is extremely important today when technologies are being developed and introduced to fabs at a rapid rate
Keywords :
integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; production testing; building-in reliability strategy; margin testing; process variation; reliability information feedback; wafer-level reliability testing; Assembly; Feedback; Instruments; Integrated circuit reliability; Process design; Reliability engineering; Robustness; Temperature; Testing; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-3598-8
Type :
conf
DOI :
10.1109/IRWS.1996.583375
Filename :
583375
Link To Document :
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