• DocumentCode
    345240
  • Title

    A high thermal conductivity waveguide window for use in a free electron laser

  • Author

    Schultheiss, T. ; Christina, V. ; Cole, M. ; Rathke, J. ; Elliott, T. ; Nguyen, V. ; Phillips, L. ; Preble, J.

  • Author_Institution
    Northrop Grumman Corp., Bethpage, NY, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    780
  • Abstract
    A high thermal conductivity waveguide window with a goal of propagating greater than 100 kW average power operating at 1500 MHz has been designed, analyzed and tested. The favorable material properties of Beryllia (BeO) make this possible. The window is brazed to a soft copper frame and then the frame is brazed to a KOVAR flange, providing the vacuum seal. RF analysis combined with thermal/structural analysis shows the benefits of the material. The KOVAR flange with a CTE, coefficient of thermal expansion, that matches that of BeO enables a strong braze joint. RF testing to 35 kW has been successful. This design can be expanded to applications with lower frequencies and higher average power, i.e., larger windows
  • Keywords
    beryllium compounds; free electron lasers; laser accessories; optical design techniques; optical materials; optical testing; optical waveguide components; optical windows; thermal analysis; thermal conductivity; thermal expansion; 100 kW; 1500 MHz; BeO; KOVAR flange; RF analysis; RF testing; analysis; average power; beryllia; braze joint; design; free electron laser; material properties; soft Cu frame; structural analysis; testing; thermal analysis; thermal conductivity; thermal expansion; vacuum seal; waveguide window; Conducting materials; Copper; Flanges; Free electron lasers; Radio frequency; Temperature; Thermal conductivity; Thermal expansion; Thermal stresses; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 1999. Proceedings of the 1999
  • Conference_Location
    New York, NY
  • Print_ISBN
    0-7803-5573-3
  • Type

    conf

  • DOI
    10.1109/PAC.1999.795353
  • Filename
    795353