Multilayer passive RF microfabrication using jet-printed au nanoparticle ink and aerosol-deposited dielectric

Author

Roberts, Robert C. ; Tien, Norman C.

Author_Institution

Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China

fYear

2013

fDate

16-20 June 2013

Firstpage

178

Lastpage

181

Abstract

We report a bi-material additive microfabrication technique combining inkjet-printed gold films and an aerosol-deposited dielectric enamel for the realization of multilayer microsystems. Hexanethiol-encapsulated gold nanoparticle ink enables metal deposition at atmospheric pressure with a maximum temperature of 200°C. Dielectric patterning is achieved via shadow mask. Process utility is demonstrated for passive radio frequency components through the realization of spiral inductors and resonant parallel L-C tanks. The resulting device parameters agree well with theory, and the resonators exhibited a Q of 60 at 596MHz, the highest quality factor of an as-printed inkjet microfabricated gold resonant structure to date.

Keywords

LC circuits; aerosols; enamels; gold; inductors; ink; ink jet printing; metallic thin films; microfabrication; micromechanical devices; nanoparticles; Au; aerosol-deposited dielectric enamel; atmospheric pressure; bi-material additive microfabrication technique; dielectric patterning; frequency 596 MHz; hexanethiol-encapsulated gold nanoparticle ink; inkjet-printed gold films; jet-printed nanoparticle ink; metal deposition; multilayer passive RF microfabrication; passive radio frequency components; resonant parallel L-C tanks; shadow mask; spiral inductors; temperature 200 degC; Additives; Dielectrics; Films; Gold; Inductors; Ink; Radio frequency; Additive Microfabrication; Gold Nanoparticles; Inkjet printing; Printed Resonator;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6626731

Filename

6626731