DocumentCode :
3455531
Title :
Modeling of AlGaN/GaN HEMTs using field-plate technology
Author :
Kaddeche, M. ; Telia, A. ; Soltani, A.
Author_Institution :
Electron. Dept., Mentouri Univ. of Constantine, Constantine, Algeria
fYear :
2009
fDate :
6-8 Nov. 2009
Firstpage :
1
Lastpage :
4
Abstract :
An analytical approach for calculating the electric field and designing field plates (FP) for reducing the peak electric field in the channel and at the surface of high electron mobility transistors (HEMTs) for a given gate and drain voltage is presented in this paper. The difference caused by the field plate is better demonstrated by the electrical field distribution in the channel. A 50% reduction of the maximum electric field, located at the drain side of the gate edge, is achieved by the introduction of the field plate, thus increasing the breakdown voltage.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; semiconductor device breakdown; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; HEMT; breakdown voltage; drain voltage; electrical field distribution; field plate technology; gate voltage; high electron mobility transistors; peak electric field; Aluminum gallium nitride; Dispersion; Electron mobility; Gallium nitride; HEMTs; Insulation; MODFETs; Piezoelectric polarization; Poisson equations; Voltage; AlGaN/GaN; Field Plate (FP); analytical modeling; high electron mobility transistor (HEMT);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signals, Circuits and Systems (SCS), 2009 3rd International Conference on
Conference_Location :
Medenine
Print_ISBN :
978-1-4244-4397-0
Electronic_ISBN :
978-1-4244-4398-7
Type :
conf
DOI :
10.1109/ICSCS.2009.5412298
Filename :
5412298
Link To Document :
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