Title :
Atomically-precise three-dimensional top down fabrication
Author :
Ballard, J.B. ; Owen, J.H.G. ; Fuchs, Emmerich ; McDonnell, S. ; Dick, D. ; Mordi, G. ; Azcatl, A. ; Seitz, O. ; Campbell, P. ; Veyan, J.F. ; Chabal, Y. ; Wallace, Robert M. ; Bischof, M. ; Jaeger, David ; Reidy, R. ; Sarkar, Niladri ; Randall, J.N.
Author_Institution :
Zyvex Labs., Richardson, TX, USA
Abstract :
Semiconductor manufacturing has provided a fabrication technology with ever-improving precision that is extremely cost-effective at producing transistors but provides poor relative precision at the limits of its resolution. Recent efforts at developing tip based nanofabrication are breaking out of 2D into 3D structures that achieve atomic precision with top down control. Coincidentally, applications that require atomic precision have begun to emerge. This talk will review progress towards atomically precise manufacturing, describe some of the near term applications such as nano electro mechanical systems, sensors, QuBit devices, and nanoimprint templates, and prospects for scaling up the throughput of atomically precise fabrication technology.
Keywords :
lithography; microfabrication; nanoelectromechanical devices; quantum computing; scanning tunnelling microscopy; semiconductor industry; sensors; 2D structures; 3D structures; QuBit devices; STM lithography; atomic precision; atomically-precise three-dimensional top down fabrication; nano electro mechanical systems; nanoimprint templates; review; semiconductor manufacturing; sensors; tip based nanofabrication; Arrays; Atomic layer deposition; Fabrication; Hardware design languages; Lithography; Silicon; Surface treatment; Atomically precise fabrication; STM lithography;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6626878