DocumentCode :
3456935
Title :
A MEMS based electrochemical seismic sensor
Author :
Deng, T. ; Chen, D.Y. ; Wang, J.B. ; Chen, Jiann-Jong ; He, W.T. ; Fan, Y.J.
Author_Institution :
Grad. Univ. of Chinese Acad. of Sci., Beijing, China
fYear :
2013
fDate :
16-20 June 2013
Firstpage :
920
Lastpage :
923
Abstract :
This paper presents a micro-electro-mechanical system (MEMS) based electrochemical seismic sensor where insulating spacers and sensing electrodes were contained in a plexiglass tube filled with an ion-rich electrolyte solution. Sensing electrodes and insulation spacers were fabricated based on MEMS processes and assembled by adhesive bonding in a layer-by-layer manner. The device performance was first characterized in a customized experimental platform, with a quantified bandwidth of 0.2-5 Hz and a linear voltage output as a function of the input vibration amplitude. A random-vibration testing in the laboratory environment was conducted, where response correlations among seven devices were calculated as 0.976±0.017, suggesting high device repeatability. This newly proposed seismic sensor may function as a promising seismic motion detecting device in the field of geophysical prospecting where low-frequency seismic motion detection is requested.
Keywords :
adhesive bonding; electrochemical electrodes; electrochemical sensors; electrolytes; insulation; microassembling; microfabrication; microsensors; pipes; seismometers; vibration measurement; MEMS based electrochemical seismic sensor; adhesive bonding; assembling; bandwidth 0.2 kHz to 5 Hz; input vibration amplitude; insulation spacer; ion-rich electrolyte solution; low-frequency seismic motion detection device; microelectromechanical system; plexiglass tube; random-vibration testing; sensing electrode; Accelerometers; Cathodes; Fabrication; Micromechanical devices; Sensors; Vibrations; MEMS; electrochemical approach; liquid proof mass; low-frequency; seismic sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
Type :
conf
DOI :
10.1109/Transducers.2013.6626918
Filename :
6626918
Link To Document :
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