DocumentCode
3457149
Title
Selection of heatsink and fan for high-temperature power modules under weight constraint
Author
Ning, Puqi ; Lei, Guangyin ; Wang, Fred ; Ngo, Khai D T
Author_Institution
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA
fYear
2008
fDate
24-28 Feb. 2008
Firstpage
192
Lastpage
198
Abstract
In the design of a high power density heatsink-fan cooling system, it is vital to understand how the geometry of the heatsink and the operating point of a fan affect the thermal performance. An analytical model has been developed for predicting the heatsink-fan system performance. There is a detailed optimization process to minimize the total weight. A typical mathematical optimization example is presented, and the results are verified via numerical simulations and experiments.
Keywords
cooling; fans; heat sinks; optimisation; thermal analysis; high power density heatsink-fan cooling system; high-temperature power module; mathematical optimization; Analytical models; Ducts; Electronics cooling; Heat engines; Heat transfer; Multichip modules; System performance; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
Conference_Location
Austin, TX
ISSN
1048-2334
Print_ISBN
978-1-4244-1873-2
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2008.4522721
Filename
4522721
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