Title :
Digital signal processing method for multilayered media thickness measurement
Author :
Delebarre, C. ; Bruneel, C. ; Miquet, P.
Author_Institution :
Lab. Opto-Acousto-Electron., CNRS, Valenciennes, France
Abstract :
An ultrasonic thickness measurement system for the 20- to 110-μm range has been developed for thin paint layers on metallic or nonmetallic substrates. In the case of a multilayered sample this system generally furnishes only the sum of the different thicknesses. Thus, a digital signal-processing method has been developed to extract the different values of thickness from the power spectral density. This method is based on a power cepstrum analysis, defined as the Fourier transform of the logarithm power spectral density of the radio-frequency signal. This technique gives, in the case of three layers, the three thicknesses and their linear combinations. Experimental results confirm the effectiveness of the proposed method
Keywords :
acoustic signal processing; thickness measurement; ultrasonic measurement; 20 to 110 micron; Fourier transform; acoustic signal processing; digital signal-processing; logarithm power spectral density; multilayered media thickness measurement; power cepstrum analysis; power spectral density; thin paint layers; ultrasonic; Delay; Digital signal processing; Fourier transforms; Frequency; Paints; Reflection; Scattering; Thickness measurement; Ultrasonic transducers; Ultrasonic variables measurement;
Conference_Titel :
Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
Conference_Location :
Chicago, IL
DOI :
10.1109/ULTSYM.1988.49533