Title :
Magnetic Wireless Interlayer Transmission Through Perpendicular MTJ for 3-D IC Applications
Author :
Liang-Shun Chang ; Ching-Hua Wang ; Kun-Yu Dai ; Kuei-Hung Shen ; Ming-Jinn Tsai ; Chrong Jung Lin ; Ya-Chin King
Author_Institution :
Inst. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
A new wireless 3-D integrated circuit connection method, magnetic-sensing transmission interface (MTI), is reported for the first time. Signal transmission through the MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a microcoil transmitter is successfully demonstrated. This new contactless magnetic signal transmission method featuring low-power, wide-bandwidth, and multilayer wireless data transmission is a viable candidate for future 3-D circuit integration technology.
Keywords :
integrated circuit interconnections; magnetic anisotropy; magnetic tunnelling; three-dimensional integrated circuits; 3D IC applications; 3D circuit integration technology; MTI; high-sensitivity sensor; magnetic signal transmission method; magnetic tunneling junction; magnetic wireless interlayer transmission; magnetic-sensing transmission interface; microcoil transmitter; multilayer wireless data transmission; perpendicular MTJ; perpendicular magnetic anisotropy; wireless 3D integrated circuit connection method; Coils; Magnetic multilayers; Magnetic tunneling; Metals; Perpendicular magnetic anisotropy; Resistance; Switches; Contactless 3-D IC integration; Non-Volatile Memory (NVM); Non-Volatile Memory (NVM).; magnetic RAM (MRAM); magnetic tunneling junction (MTJ);
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2324591
