Magnetic Wireless Interlayer Transmission Through Perpendicular MTJ for 3-D IC Applications

Author

Liang-Shun Chang ; Ching-Hua Wang ; Kun-Yu Dai ; Kuei-Hung Shen ; Ming-Jinn Tsai ; Chrong Jung Lin ; Ya-Chin King

Author_Institution

Inst. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan

Volume

61

Issue

7

fYear

2014

fDate

Jul-14

Firstpage

2480

Lastpage

2485

Abstract

A new wireless 3-D integrated circuit connection method, magnetic-sensing transmission interface (MTI), is reported for the first time. Signal transmission through the MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a microcoil transmitter is successfully demonstrated. This new contactless magnetic signal transmission method featuring low-power, wide-bandwidth, and multilayer wireless data transmission is a viable candidate for future 3-D circuit integration technology.

Keywords

integrated circuit interconnections; magnetic anisotropy; magnetic tunnelling; three-dimensional integrated circuits; 3D IC applications; 3D circuit integration technology; MTI; high-sensitivity sensor; magnetic signal transmission method; magnetic tunneling junction; magnetic wireless interlayer transmission; magnetic-sensing transmission interface; microcoil transmitter; multilayer wireless data transmission; perpendicular MTJ; perpendicular magnetic anisotropy; wireless 3D integrated circuit connection method; Coils; Magnetic multilayers; Magnetic tunneling; Metals; Perpendicular magnetic anisotropy; Resistance; Switches; Contactless 3-D IC integration; Non-Volatile Memory (NVM); Non-Volatile Memory (NVM).; magnetic RAM (MRAM); magnetic tunneling junction (MTJ);

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2014.2324591

Filename

6824832