DocumentCode
3459779
Title
Impact of passivation film deposition and post-annealing on the reliability of flash memories
Author
Shuto, Susumu ; Tanaka, Miwa ; Sonoda, Masahisa ; Idaka, Toshiaki ; Sasaki, Kenichi ; Mori, Seiichi
Author_Institution
ULSI Device Eng., Toshiba Corp., Kawasaki, Japan
fYear
1997
fDate
8-10 Apr 1997
Firstpage
17
Lastpage
24
Abstract
This paper presents the impact of the passivation film deposition with various compositions and structures on the reliability of tunnel oxide in flash memories. The enhancement of the tunnel oxide degradation strongly depends on the refractive index of P-SiON passivation film. This result means that there is a correlation between the water resistibility of the passivation film and the tunnel oxide degradation induced by the passivation film deposition process. Moreover, the effect of post-annealing after passivation film deposition is discussed. The electron trap density is increased at the beginning and then decreased during post-annealing. The time constant of this phenomenon strongly depends on the refractive index of the passivation film. We propose the water-related electron trap model to explain the results
Keywords
EPROM; MOSFET; annealing; electron traps; integrated circuit reliability; passivation; refractive index; semiconductor device reliability; NMOSFET; P-SiON passivation film; SiN-SiO2; SiON; electron trap density; flash memory reliability; passivation film deposition; post-annealing; refractive index; time constant; tunnel oxide degradation; water resistibility; water-related electron trap model; Annealing; Capacitors; Circuit testing; Degradation; Flash memory; Optical films; Passivation; Refractive index; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International
Conference_Location
Denver, CO
Print_ISBN
0-7803-3575-9
Type
conf
DOI
10.1109/RELPHY.1997.584223
Filename
584223
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