Title :
New power module concept by forced-air cooling system for power converter
Author :
Kodani, K. ; Tsukinari, T. ; Matsumoto, T.
Author_Institution :
Toshiba Corp., Fuchu, Japan
Abstract :
Power electronic converters use power semiconductor devices. By improvement of the device performances, the electric power density, defines as ratio of converter output power and converter volume, is continuously increased. However, volume of the Cooling System to occupy a substantial portion of power electronic converter, therefore improvement of the Cooling System performance is one of the important problems. In this paper, optimized forced-air cooling system and new power module design concept are introduced.
Keywords :
cooling; heat sinks; power semiconductor devices; electric power density; forced-air cooling system; power electronic converters; power module concept; power semiconductor devices; Electronics cooling; Heat sinks; Multichip modules; Power electronics; Refrigerants; Resistance heating; System performance; Thermal force; Thermal resistance; Water heating; Cooling system; Heat sink; optimum; power density; power module; simulation;
Conference_Titel :
Power Electronics Conference (IPEC), 2010 International
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-5394-8
DOI :
10.1109/IPEC.2010.5543288
