Title :
A novel package approach for multichip modules based on anisotropic conductive adhesives
Author :
Heyen, Johann ; Jacob, Arne F.
Author_Institution :
Surface Acoust. Wave Components, Multilayer Integrated Products, Modules & Special Products, EPCOS AG, Munich, Germany
Abstract :
In this paper, anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabilities is presented.
Keywords :
adhesives; anisotropic media; heat transfer; integrated circuit interconnections; multichip modules; system-in-package; anisotropic conductive adhesive; anisotropic conductive pastes; cavity-up millimeter-wave package; electrical interconnection; heat transfer; mechanical interconnection; millimeter-wave multichip module; Anisotropic magnetoresistance; Bonding; Conductive adhesives; Frequency; Integrated circuit interconnections; MMICs; Millimeter wave technology; Multichip modules; Packaging; Testing;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1610235
