Title :
Wafer level sandwich packaging technology for three-axis piezoresistive accelerometer
Author :
Aono, T. ; Kazama, A. ; Okada, Ryutaro ; Hata, Satoshi ; Sakamoto, E.
Author_Institution :
Hitachi Res. Lab., Hitachi, Ltd., Hitachi, Japan
Abstract :
A technology for packaging a three-axis piezo-resistive accelerometer, namely, “wafer level sandwich packaging” was developed. This technology consists of three key processes: first, concurrent bonding of three stacked wafers; second, eutectic bonding using Au-Sn alloyed metal; and third, a top cap separation by polishing. It was used to fabricate the smallest dies for a piezoresistive accelerometer, namely, 1.18 mm wide, 1.32 mm long and 0.6 mm high, reported to date.
Keywords :
accelerometers; gold alloys; microsensors; piezoresistive devices; polishing; tin alloys; wafer bonding; wafer level packaging; MEMS devices; concurrent stacked wafer bonding; dies fabrication; eutectic bonding; piezoresistive accelerometer; polishing; size 0.6 mm; size 1.32 mm; size 1.8 mm; top cap separation; wafer level sandwich packaging technology; Accelerometers; Bonding; Gold; Nickel; Piezoresistance; Substrates; Au-Sn alloyed metal; Wafer level package; air damping; eutectic bonding; piezoresistive accelerometer;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6627180
