DocumentCode
3462067
Title
ICSICT-2006 - 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Title
fYear
2006
fDate
23-26 Oct. 2006
Abstract
The following topics are dealt with: advanced CMOS devices; mobility enhancement; Si devices and device physics; advanced interconnect technology; gate stack technology; process technology; integrated circuit manufacturing; MEMS; memory; compound semiconductors; ferroelectric materials; semiconductor materials; quantum structures; nanoelectronics; device modeling; process modeling; CMOS integrated circuits; HF/RF design; low power design; analog circuits; mixed-signal circuits; ultra-wideband transmitter; RF system integration; integrated circuit design and verification; packaging and testing; characterization
Keywords
CMOS integrated circuits; analogue integrated circuits; carrier mobility; ferroelectric materials; integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated memory circuits; low-power electronics; micromechanical devices; mixed analogue-digital integrated circuits; nanoelectronics; radiofrequency integrated circuits; semiconductor devices; semiconductor materials; semiconductor process modelling; CMOS integrated circuits; HF/RF design; MEMS; RF system integration; Si devices; advanced CMOS devices; advanced interconnect technology; analog circuits; compound semiconductors; device modeling; device physics; ferroelectric materials; gate stack technology; integrated circuit design; integrated circuit manufacturing; low power design; memory; mixed-signal circuits; mobility enhancement; nanoelectronics; packaging; process modeling; process technology; quantum structures; semiconductor materials; testing; ultra-wideband transmitter;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Type
conf
DOI
10.1109/ICSICT.2006.306033
Filename
4097998
Link To Document