• DocumentCode
    346303
  • Title

    Technology scaling behavior of optimum reverse body bias for standby leakage power reduction in CMOS IC´s

  • Author

    Keshavarzi, Ali ; Narendra, Siva ; Borkar, Shekhar ; Hawkins, Chuck ; Roy, Kaushik ; De, Vivek

  • Author_Institution
    MicroComput. Res. Lab., Intel Corp., Hillsboro, OR, USA
  • fYear
    1999
  • fDate
    17-17 Aug. 1999
  • Firstpage
    252
  • Lastpage
    254
  • Abstract
    We demonstrate that, there is an optimum reverse body bias, unique to any technology generation, that minimizes the standby leakage power consumption of an IC design implemented in that technology. We also show: (1) the optimum reverse body bias value reduces by /spl sim/2X per technology generation, and (2) the maximum achievable leakage power reduction by reverse body biasing diminishes by /spl sim/4X per generation under constant field technology scaling scenario. Optimum point occurs as a result of reduction in subthreshold leakage and an increase injunction band-to-band tunneling leakage with applied reverse bias. Therefore, new junction engineering techniques to reduce the bulk band-to-band tunneling leakage current component across the junction are needed to preserve the effectiveness of reverse body biasing for standby leakage control in future technologies.
  • Keywords
    CMOS integrated circuits; integrated circuit design; integrated circuit technology; leakage currents; low-power electronics; tunnelling; CMOS ICs; IC design; applied reverse bias; injunction band-to-band tunneling leakage; junction engineering techniques; optimum reverse body bias; standby leakage power reduction; subthreshold leakage; technology scaling behavior; CMOS technology; Energy consumption; Leakage current; Logic devices; Logic testing; P-n junctions; Power generation; Power measurement; Subthreshold current; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design, 1999. Proceedings. 1999 International Symposium on
  • Conference_Location
    San Diego, CA, USA
  • Print_ISBN
    1-58113-133-X
  • Type

    conf

  • Filename
    799449