• DocumentCode
    3463389
  • Title

    Temperature derivatives of elastic stiffness evaluated from the SAW delay-temperature behavior on lithium tantalate plates

  • Author

    Kozlov, A.S. ; Taziev, R.M. ; Vasiliev, L.L. ; Yakovkin, L.B.

  • Author_Institution
    Inst. of Semicond. Phys., Acad. of Sci., Novosibirsk, Russia
  • Volume
    1
  • fYear
    1995
  • fDate
    7-10 Nov 1995
  • Firstpage
    393
  • Abstract
    The paper presents an accurate evaluation of the temperature derivatives of elastic stiffness of lithium tantalate on SAW delay-temperature dependence data. We use a nonlinear formalism to correct describing SAW propagation on X,Y-cuts of lithium tantalate plates subjected to homogeneous thermally-induced deformation. A least squares method is used to fit the temperature derivatives of the elastic constants of lithium tantalate to the measured SAW temperature coefficients of delay of the first order (TCD1). To decrease computation time, the perturbation procedure is employed. This allows us to fit optimally the constants of crystals in order to get the coincidence with experimental SAW delay-temperature data using only one iteration step. To measure the SAW temperature coefficients of delay we used a new high-sensitivity method. The measurement errors of TCDI are better than 0.15%. The sensitivity ofthe method is about 0.01%
  • Keywords
    delays; elastic constants; iterative methods; least squares approximations; lithium compounds; surface acoustic wave devices; surface acoustic waves; LiTaO3; SAW delay-temperature behavior; computation time; elastic constants; elastic stiffness; high-sensitivity method; homogeneous thermally-induced deformation; iteration step; least squares method; nonlinear formalism; perturbation procedure; Crystalline materials; Crystals; Equations; Least squares methods; Lithium compounds; Propagation delay; Surface acoustic waves; Temperature dependence; Temperature measurement; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1995. Proceedings., 1995 IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-2940-6
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1995.495605
  • Filename
    495605