Title :
Modeling the cost of ownership of assembly and inspection
Author :
Dance, Daren L. ; DiFloria, Thomas ; Jimenez, David W.
Author_Institution :
Wright Williams & Kelly, Austin, TX, USA
Abstract :
This paper will use a manufacturing example to illustrate the impacts of robustness, repeatability, and accuracy on COO. By considering life cycle costs as a function of the total number of good devices manufactured over the equipment life, the COO impact of manufacturing and inspection can be estimated in terms of cost per good unit
Keywords :
assembling; costing; economics; inspection; integrated circuit manufacture; semiconductor process modelling; accuracy; assembly; cost of ownership; cost per good unit; inspection; life cycle costs; manufacturing; modelling; repeatability; robustness; semiconductor process step cost; wafer fabrication tool; Assembly; Assembly systems; Calibration; Cost function; Costs; Fabrication; Inspection; Life estimation; Manufacturing; Pulp manufacturing; Robustness; Semiconductor device modeling; Semiconductor materials; Standards development; Throughput;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526090
