• DocumentCode
    3465232
  • Title

    System-level dynamic simulation for a MEMS clamped-beam based on the mechanical description

  • Author

    Zhang, Jian ; Li, Weihua ; Huang, Aing-An

  • Author_Institution
    Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    602
  • Lastpage
    604
  • Abstract
    A method for developing the equivalent lumped electrical circuit based on the mechanical description of MEMS structures is proposed, which is used to carry out the system-level simulation of the dynamic behavior of the electromechanically coupled clamped-beam. The main idea of the method is to take the maximum displacement for the common variable, develop the equivalent mechanical description with the help of the mechanical analysis in combination with the energy principle, and implement the coupling process by feedback mechanism of the controlled sources. The equivalent electrical circuit can be used to simulate the transient response and frequency-shifting characteristic of the beam under electrostatic loads. Simulation from Saber in CoventorWare has confirmed the validity of the method
  • Keywords
    beams (structures); equivalent circuits; lumped parameter networks; micromechanical devices; transient response; CoventorWare; MEMS clamped-beam; MEMS structures; Saber; coupling process; electromechanically coupled clamped-beam; electrostatic loads; equivalent lumped electrical circuit; feedback mechanism; frequency-shifting characteristic; mechanical analysis; mechanical description; system-level dynamic simulation; transient response; Circuit simulation; Coupling circuits; Displacement control; Electric variables control; Electrostatics; Feedback; Frequency; Mechanical variables control; Micromechanical devices; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306388
  • Filename
    4098180