• DocumentCode
    34670
  • Title

    On-Wafer Terahertz Ribbon Waveguides Using Polymer–Ceramic Nanocomposites

  • Author

    Xianbo Yang ; Chahal, Premjeet Prem

  • Author_Institution
    Dept. of Electr. & Comput. EngineeringTerahertz Syst. Lab., Michigan State Univ., East Lansing, MI, USA
  • Volume
    5
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    245
  • Lastpage
    255
  • Abstract
    This paper investigates the design and fabrication of thin dielectric ribbon waveguides for terahertz (THz) circuit applications. Simulations indicate that dielectric thin ribbon waveguides provide low loss THz wave propagation when a combination of high dielectric constant (high-k ) core and low dielectric constant (low-k ) cladding are used. This combination provides stronger field confinement which helps in reducing losses at waveguide bends and allows higher density integration. Two different fabrication approaches are investigated: 1) photopatterning of spin coated nanocomposite thin films and 2) laser cutting of dry nanocomposite thin films. Characterization of nanocomposites-based waveguides is carried out over a wide frequency range in the THz spectral region. Measurements of a variety of different waveguide samples validate the simulated results and prove that low cost, wafer-level planar THz integrated circuits can be realized with polymer ceramic nanocomposite thin ribbon waveguides.
  • Keywords
    ceramics; high-k dielectric thin films; integrated circuits; laser beam cutting; low-k dielectric thin films; nanocomposites; permittivity; polymers; rib waveguides; spin coating; wave propagation; THz circuit applications; density integration; dielectric thin ribbon waveguides; dry nanocomposite thin films; fabrication approaches; field confinement; high dielectric constant core; high-k core; laser cutting; low dielectric constant cladding; low loss THz wave propagation; low-k cladding; on-wafer terahertz ribbon waveguides; photopatterning; polymer-ceramic nanocomposites; spin coated nanocomposite thin films; wafer-level planar integrated circuits; Dielectric constant; Dielectric losses; High K dielectric materials; Integrated circuit modeling; Planar waveguides; Propagation losses; High density integration; interconnects; passives; passives.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2390611
  • Filename
    7018964