Title :
Dynamic NBTI characteristics of p-MOSFET with N-plasma SiON Gate Dielectric
Author :
Yan, B.G. ; Kang, J.F. ; Sa, N. ; Liu, X.Y. ; Du, G. ; Han, R.Q. ; Liao, C.C. ; Gan, Z.H. ; Liao, M. ; Wang, J.P. ; Wong, W.
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing
Abstract :
In this paper, the dynamic negative bias temperature instability (DNBTI) characteristics of p-MOSFET with N-plasma SiON dielectric are studied. Under dynamic stress, the nearly consistent frequency dependent characteristics of threshold voltage shift (DeltaVth) and interface trap density (DeltaNit) were observed. The results show that the degradation and recovery of DNBTI are still dominated by the generation and passivation of the interfacial traps associated with Si-H bond breaking and released H species diffusion during stress phase and back diffusion of H and repassivation of broken equivSi bonds during passivation phase, which could be depicted by the so-called reaction-diffusion (R-D) model. Meanwhile, the reduced passivation effect with increased stress time was observed, which suggests that the generation and passivation of Nit seems to present a fatigue effect. These observed DNBTI characteristics may relate to the nitrogen trapping effect on the diffusion of H species in SiON dielectric layer
Keywords :
MOSFET; dielectric materials; hydrogen; interface states; nitrogen; passivation; reaction-diffusion systems; semiconductor device models; silicon; silicon compounds; thermal stability; H species diffusion; N-plasma SiON gate dielectric; Si-H; Si-H bond; SiON; SiON dielectric layer; dynamic NBTI characteristics; dynamic negative bias temperature instability; dynamic stress; fatigue effect; interface trap density; interfacial traps; nitrogen trapping effect; p-MOSFET; passivation effect; reaction-diffusion model; threshold voltage shift; Dielectrics; Diffusion bonding; Frequency dependence; MOSFET circuits; Negative bias temperature instability; Niobium compounds; Passivation; Stress; Threshold voltage; Titanium compounds;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306055