DocumentCode :
3469592
Title :
Study of the SEU Effect Mechanism on SOI PMOS by 2-D Simulation
Author :
Zhao, Fa-Zhan ; Guo, Tian-Lei ; Hai, Chao-He ; Liu, Meng-xin
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
1346
Lastpage :
1348
Abstract :
2D device simulation with an ideal condition is used to study the mechanism for single-event upset (SEU) of SOI pMOS, which can be more significant in SRAM when gate length is scaling down. The mechanism can be associated with displacement current. Displacement currents across the box layer can be induced as charge is generated in the SOI substrate by an ion strike. It perturbs the electric fields in the substrate near the oxide/substrate interface, thus an abnormal current is observed in drain. The displacement current is related to the box layer thickness, the substrate doping species and concentration, also the drain area. Therefore all this parameter is critical in the design of SOI SRAM ICs
Keywords :
MOS memory circuits; SRAM chips; integrated circuit design; radiation hardening (electronics); silicon-on-insulator; 2D device simulation; SEU effect mechanism; SOI substrate; SRAM; ion strike; on SOI PMOS; oxide-substrate interface; single-event upset; Chaos; Doping; Microelectronics; Random access memory; Semiconductor films; Semiconductor process modeling; Silicon; Single event upset; Substrates; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306156
Filename :
4098404
Link To Document :
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